Q8RFG3

Powerful Third Generation RFSoC SDR/Processor Card

Based on the original Q8RF, the Xiphos Q8RFG3 uses the third generation Zynq UltraScale+ RFSoCs (RF System-on-Chip) devices which add upgrades to the digitization portion of the architecture, the RF input bandwidth and the ability to synchronize multiple Q8RFG3s together for applications such as digital beam forming. These Zynq devices are highly integrated system-on-chip devices from AMD Xilinx that combine high-speed RF-class ADCs and DACs, programmable FPGA logic, and embedded ARM processors on a single chip.

This architecture enables direct RF sampling and real-time digital signal processing without the need for external data converters or complex analog front ends. By tightly coupling processing and conversion resources, RFSoCs significantly reduce system size, weight, power, and latency—making them ideal for advanced RF applications that demand high channel density, wide bandwidth, and low-latency signal chain control.

Xiphos has combined these RFSoC devices with its fault-tolerant space architecture that has been developed over more than two decades to ensure trouble-free operation in-orbit.

Spec sheet

Q8RFG3 Applications and Use Cases for Advanced Space Missions

Why did we make our latest RF space processor? What do people do with it? In this video, Xiphos explores Q8RFG3 applications and use cases, offering a closer look at the mission needs driving onboard RF processing and the role it can play in enabling more capable spacecraft systems. Watch to learn how these capabilities can support your next mission.

FEATURE HIGHLIGHTS

Third generation RFSoC devices enabling direct sampling of RF. Q8RFG3 has improved RF specs over the Q8RF and allows synch across boards.

Physical Size (mm)	Typical Power Consumption (W)
100 x 100 x 20	20-35
Processor	CPU
Xilinx Zynq UltraScale+ Quad core up to 1.2 GHz	Dual core ARM Real Time Processing Unit at up to 500 MHz
DRAM	Boot Image Storage
4 GB PS LPDDR4 DRAM (with EDAC) 4 GB PL DDR4 DRAM	2x 256 MB NOR Flash
Mission Data Storage	Control FPGA
2x 128 GB eMMC	Microchip ProASIC3 implements XiphosGuard Robustness features (Robust Boot, Watchdog, RDP)
RF Coverage	Digitizers
6 GHz	14 bit
TRL
TRL6 2026

Q8RFG3 RFSoC offers the following key features:

Model	Q8RFG3
Environmental Characteristics
Temperature (operating)	De-rated to -40 to +60 °C
Size	100 mm x 100 mm x 20 mm
Weight	200 g
Power (Typ.)	25-35 W @ 5-15 V
Memory
Memory	4 GB PS LPDDR4 DRAM (with EDAC) 4 GB PL DDR4 DRAM 2x 256 MB QSPI Flash (NOR)
Storage	2x 128 GB eMMC
MPSoC
Model	ZU48DR
Application Processing Unit	Quad-core ARM Cortex A53 Application Processing Unit at up to 1.2 GHz
Real-Time Processing Unit	Dual-core ARM Cortex-R5 @ 500 MHz
ADCs	8, each 5.0 GSPS max; 14-bit
RF Input Frequency, max	6 GHz
DACs	8, each 9.85 GSPS max; 14-bit
Decimation/ Interpolation	1x, 2x, 3x, 4x, 5x, 6x, 8x, 10x, 12x, 16x, 20x, 24x, 40x
System Logic Cells	930,000
CLB Flip Flops	850,000
CLB LUTs	425,000
DSP Slices	4,272

Model	Q8RFG3
Control FPGA
	Microchip ProASIC3
Operating System
	Yocto Linux BSP (LTS distribution)
Bottom RF Mezzanine Connector
	8x Transmit + 8x Receive RF Ext Ref Clock(s) In, Ref Clock Out
Bottom I/O Mezzanine Connector
	46x LVDS or 92x 1.8V GPIO, 39x 3.3V GPIO 16x 28.21 Gbps GTY transceivers supporting PCIe Gen 3 & 100G Ethernet 3x GTR transceivers supporting PCIe Gen 2 & SATA

CONFIGURATIONS

We offer several standard configurations which offer the lowest costs and fastest deliveries.

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Q8RFG3-001

Standard engineering and flight model configuration. This model is used by customers to mate with their custom daughter board. Development can begin right away leveraging the power, Ethernet, Linux console and digital interfaces provided by the PIM.

Q8RFG3-002

This model comes installed on a RF breakout board to support RF testing right away but is otherwise identical to Q8RFG3-001.

Configuration	Q8RFG3-001	Q8RFG3-002
EM Uncoated	XS011-10002-002-02-A	XS011-10005-001-02-A
FM Uncoated	XS011-10001-001-01-A	-
FM Coated	XS011-10001-002-01-A	-
Startup voltage	5.0 V
Brownout voltage	4.5 V
Global Hardware Overcurrent Limit	3 A
PUDC option (Pull-Up During Configuration)	Pull-up active
RF DAC onboard PLL bypass	Onboard PLLs
RF ADC onboard PLL bypass	Onboard PLLs
RF SYSREF clock coupling	DC coupled
VCXO Configuration	122.88 MHz
GTY and GTR AC Coupling capacitor value	100 nF
Serial Comms
ttyPS0 routing (RDP)	PIM serial to USB connector
ttyPS1 routing (RDP)	Serial port pins in the mezzanine connector	RS422 on Breakout Board J8
ttyS2 routing	Serial port pins in the mezzanine connector	RS422 on Breakout Board J8

SPACE COMPUTING PRODUCTS - RELATIVE PERFORMANCE

There are many attributes and trade-offs when comparing performance between computing platforms. These graphs give an idea of how the different models compare to each other. These represent a comparison of Q-Card processor boards; daughterboards may add additional resources.

Q8RFG3 - 01

Q8RFG3 - 02

Q8RFG3 - 03

Q8RFG3 - 04

Q8RFG3 - 05

Q8RFG3 - 06

* The Q9 A72 supports out of order execution, larger cache, and faster clock speed etc.

Specific Use

The Q8RF family is ideal for space applications that require high performance, wide bandwidth, multi-channel SDR payloads. It is often used for applications such as broadband communications, Internet of Things (IoT), RF sensing & SIGINT, beam-forming, and Synthetic Aperture Radar (SAR).

Did you know

In addition to our standard daughterboards, we offer application-specific development integrating our powerful Q-Card processors with the interfacing options and application-specific electronics you require. Contact our team to learn more about customization.

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